On-Die And In-Package Interconnects

We live in the Information Age, but if information cannot get to where it’s intended to go, it does no good. And the way information gets from here to there is through interconnects.

This report focuses on different interconnect structures, such as lines, vias, buses, and networks-on-chip, and how they’re constructed. As always, we consider the design, test, reliability, and security implications related to interconnects.

We cover mainstream versions of the technology through mid-2025. Additional developments can be found in a list of articles and research stories. As those topics go mainstream, we will work them into the main text in future updates.

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